File:Silicon chip 3d.png

Summary
3D View of a small integrated circuit standard cell with three metal layers. The top tan-colored structures are metal interconnects, with the vertical pillars being contacts, usually tungsten is used for the plugs. The reddish structures are polysilicon gates, and the solid at the bottom is the crystalline silicon bulk. This is an image I made myself, using my own software. As far as I'm concerned, you can do whatever you like with it.

Date: 2006-07-15 (first version); 2007-01-25 (last version) - Later version(s) were uploaded by Tene Author:David Carron - This work has been released into the public domain by its author, David Carron. This applies worldwide. In case this is not legally possible: David Carron grants anyone the right to use this work for any purpose, without any conditions, unless such conditions are required by law.